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Program tackles challenges that remain in bringing EUVL to high volume manufacturing.
June 25, 2015
By: DAVID SAVASTANO
Toshiba Corporation, SanDisk Corporation and imec have expanded their strategic partnership, with Toshiba and SanDisk joining imec’s industrial affiliation program on advanced patterning. This program tackles the critical challenges that remain in bringing EUVL to high volume manufacturing. The program also develops other technologies for extending 193nm immersion lithography. Toshiba and SanDisk have been core partners in imec’s industrial affiliation program in Advanced Memory since 2011.  “To date, this program, supported by our world-class infrastructure, represents the largest investment in advanced lithography equipment in the world,” said Luc Van den hove, President and CEO at imec.  “Our participation in imec’s advanced patterning program provides us access to state-of-the-art lithography infrastructure for EUV technology R&D,” said Dr. Ritu Shrivastava, VP, technology development, SanDisk.  Imec’s research into advanced patterning includes GLOBALFOUNDRIES, INTEL, Micron, Panasonic, Samsung, SK Hynix, Sony, Toshiba/SanDisk and TSMC.
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